ASIP provides all the services related to package design, simulation, extraction, and delivering working substrates. Several engineers are experienced in Lead frame and RDL design. The designs can be executed with minimal supervision and/or in collaboration with customers' design teams. Several complex package designs have already been delivered with 100% satisfaction.

A sample of packages we have worked on are:

  • QFN
  • QFP
  • BGA
  • MCM
  • MCP
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