Package Design

ASIP provides complete turn-key solution for IC Packaging including Package Architecture, Package Design & Layout, Simulations (SI/PI & Thermal), Substrate/Interposer design meeting all the KPIs & quality requirements for the Product IC Package.

    • Package Design/ Modelling
    • Pin Specifications
    • Layout & Routing
    • Signal Integrity
    • Power Integrity
    • Thermal Analysis
    • Parameters extraction
    • Substrate/RDL/Interposer Design
    • DFM (Design-for-Mfg) checks
    • Package KPIs & Quality checks