Michel Villemain, Advisory Member
Michel Villemain has more than 30 years of experience in the semiconductor business. He has been the CEO of Presto Engineering, since he founded the company in 2006. Michel has been Vice President Marketing at FEI, and General Manager of the CD-SEM Business Unit at KLA-Tencor. Michel started his career with Schlumberger (later NPTest), where he served in various technical and managerial capacities over 19 years, in Europe, Texas and California. He has served as General Manager for Schlumberger ATE Europe, Vice President Marketing of the Test Division, and General Manager of the Probe (IDS) Division. Michel graduated from Ecole Polytechnique in France, and holds a Ph.D. in Computer Science from Orsay University.
B. J. (Byung) Han, Advisory Member
B. J. (Byung) Han has more than 35 years of experience in semiconductor industry. He has been Chairman & CEO of STATS ChipPAC and various management and research positions experience in Amkor, Bell Laboratories & IBM in Singapore, Korea and USA. He is currently a board member of several publicly traded companies and advisor to Bain, Co. He holds Ph.D. in Engineering from Columbia University and completed AMP from Harvard Business School.
Ramesh Singh, Advisory Member
Ramesh Singh is an experienced investor, advisor, board member, serial entrepreneur and a veteran with over 40 years in the semiconductor industry. Starting his career as an engineer and eventually building his own companies that include MediaQ and Nethra Imaging. Ramesh currently holds board position at VVDN a leading ESDM company headquartered in India. Ramesh holds a master's degree in electrical engineering from Southern Methodist University and a bachelor's degree in electrical engineering from the University of Kentucky.
Rajan Rajagopal, Advisory Member
Seasoned semiconductor professional with over 25 years of global corporate experience spanning Asia, Europe and US in P&L management, quality, customer management, new product introduction and high volume manufacturing excellence. Innovative and resourceful problem-solver with demonstrated leadership track record of transforming global teams to collectively deliver improved profitability and competitive position, world class quality and exceptional customer service levels in a high-tech manufacturing environment.
Dr. Subramanian Iyer, Advisory Member
Subramanian S. Iyer (Subu) is Distinguished Professor and holds the Charles P. Reames Endowed Chair in the Electrical Engineering Deaprtment at the University of California at Los Angeles. He is the Director of Center of Heterogeneous Integration and Performance Scaling (UCLA CHIPS). Prior to that he was an IBM fellow. His key technical contributions have been the development of the world's first SiGe base HBT, Salicide, electrical fuses, embedded DRAM and 45nm technology node used to make the first generation of truly low power portable devices as well as the first commercial interposer and 3D integrated products. More recently, he has been exploring new packaging paradigms and device innovations that may enable wafer-scale architectures, in-memory analog compute and medical engineering applications.